Hangzhou Xinyun Technology Co., Ltd. was founded, which is located in Singapore Science&Technology Park, Hangzhou, China.
▶ 2017.12
Angel round financing.
Brought in capital institutions such as Puhua Capital (2017 Top6), Bank of China Investment Zheshang Industry Fund, Silan Ventures (600460.SH) and others to complete a 40 million RMB investment.
Released the world's first 100G optical device that meets the 40KM transmission standard.
▶ 2018.8
Our R&D team grew, and the optical devices and ICs started mass production.
▶ 2019.2
Monthly shipment of 100G series optical devices exceeded 1,000pcs.
▶ 2019.Q1
Completed A round of financing of nearly 100 million RMB with participation of local industrial funds such as Yuhang Industrial Fund and Financial Control，and also the investment by old shareholders.
Signed the investment of 4.94 acres + 3.29 acres of land in Yuhang District.
We obtained ISO9000&ISO14000 certification.
▶ 2019.9 CIOE
Released 5G fronthaul 25G full wavelength tunable product.
Released 100G CWDM 2KM/10KM silicon photonics single chip solution，28/32/56G EML Driver，PMIC for APD Application.
▶ 2020.3
Mass production of 4x28G|100G TIA chip.
Mass production of 28/32/56G MZM Driver.
Mass production of 4x25G APD ROSA can support 60km transmission.
▶ 2020.8
Construction of 40,000 square meters production base started.
▶ 2020.9
Completed nearly 400 million RMB in series B financing, led by CICC Capital, and IDG, Haitong Innovation, Zhejiang University Youchuang, CITIC Construction Investment, Zhejiang Venture Capital and Puhua Zhejiang Energy followed the investment.
Mass production of the first 25G full C-band tunable device in the worldwide, 25/28Gx4 DML driver, silicon photonics control chip.
Released 25/28Gx4 CDR.
▶ 2020.10
Released 4x25G DML TOSA.
▶ 2020.12
Mass production of Limiting TIA(including 10G APD TIA,25G APD/PIN TIA, 4x25G APD/PIN TIA).
▶ 2021.5
Mass production of DML Driver、APD DCDC.
▶ 2021.6
Mass production of 4x25G DML TOSA.
▶ 2021.7
Released 25G/4*25G CDR.
▶ 2021.10
Released 100G/4x100G Linear TIA product.
▶ 2021.12
Released a complete set of 25G/4*25G chip product solutions.
Mass production of 10G APD TO/ROSA.
▶ 2022.3
50G/100G & 4x100G Linear TIA product iteration.
▶ 2022.4
Released 4x25G ZR4 ROSA.
▶ 2022.6
Released 100G CWDM4 integrated chip.
▶ 2022.7
Mass production of 25G/4x25G NRZ CDR product.
▶ 2022.8
Released XY5921EB(25G CDR+EML-Drv for ER/DWDM).
Released XG/XGS-PON BM burst TIA ,EPON/10G EPON BM burst TIA product.
